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Pin 2 is in electrical contact with the mounting base. Emitter-base voltage. Continuous collector current. Peak collector current see Note 1. Continuous base current. Unclamped inductive load energy see Note 4. Operating junction temperature range. Storage temperature range. Lead temperature 3. V CBO. V CEO. V EBO. P tot. T stg. NOTES: 1. Information is current as of publication date.
Products conform to specifications in accordance. Production processing does not. This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic.
The compound will withstand soldering temperature with no deformation, and circuit performance. Leads require no additional. The centre pin is in electrical contact with the mounting tab.
Mounting tab corner profile according to package version. Typical fixing hole centre stand off height according to package version. Version 1, Version 2, Products conform to specifications in accordance with the terms of Power Innovations standard warranty.
Production processing does not necessarily include testing of all parameters. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions.
Leads require no additional cleaning or processing when used in soldered assembly. Siemens Semiconductor Group. Power Innovations Limited.
Bourns Electronic Solutions. Analog Devices.
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